Ukulawula okuzenzakalelayo kwezinga lokushisa nomswakama
Izinga lokushisa kanye nomswakama wekamelo elihlanzekile kunqunywa ngokuyinhloko ngokuvumelana nezidingo zenqubo, kodwa ngaphansi kwesimo sokuthi izidingo zenqubo zifinyelelwa, ukunethezeka komuntu kufanele kucatshangelwe.Ngokukhula kwezidingo zokuhlanzeka komoya, kukhona ukuthambekela kokuthi inqubo inezidingo eziqinile ngokuya ngezinga lokushisa kanye nomswakama.
Njengoba ukunemba komshini kuya ngokuba kuhle kakhulu, izimfuneko zebanga lokuguquguquka kwezinga lokushisa ziya ziba zincane ngokuba zincane.Isibonelo, kunqubo yokuvezwa kwe-lithography yokukhiqizwa kwesekethe ehlanganisiwe yezinga elikhulu, umehluko phakathi kwe-thermal coefficient yengilazi ne-silicon wafer njengoba impahla ye-diaphragm idingeka ukuthi ibe yincane futhi ibe yincane.Iwafa ye-silicon enobubanzi obungu-100μm izobangela ukunwetshwa komugqa okungu-0.24μm lapho izinga lokushisa likhuphuka ngedigri elingu-1.Ngakho-ke, kufanele ibe nezinga lokushisa elingaguquki elingu-± 0.1 degrees.Ngesikhathi esifanayo, inani lomswakama ngokuvamile liyadingeka ukuba libe liphansi, ngoba ngemva kokujuluka komuntu, umkhiqizo uzongcoliswa, ikakhulukazi Kuma-workshops we-semiconductor abesaba i-sodium, lolu hlobo lwe-workshop ehlanzekile akufanele ludlule ama-degree angu-25.
Umswakama owedlulele udala izinkinga eziningi.Uma umswakama ohlobene udlula ama-55%, ukujiya kuzokwenzeka odongeni lwepayipi lamanzi okupholisa.Uma kwenzeka kudivayisi enembayo noma isekethe, kuzodala izingozi ezahlukahlukene.Kulula ukugqwala lapho umswakama ohlobene ungama-50%.Ngaphezu kwalokho, lapho umswakama uphezulu kakhulu, uthuli olungaphezulu kwe-silicon wafer luzokhangiswa ngamakhemikhali ngamamolekyuli amanzi asemoyeni phezulu, okunzima ukuwasusa.Ukuphakama komswakama ohlobene, kuba nzima nakakhulu ukususa ukunamathela, kodwa lapho umswakama ohlobene ungaphansi kuka-30%, izinhlayiya zibuye zikhangiswe kalula ebusweni ngenxa yesenzo samandla kagesi, kanye nenani elikhulu le-semiconductor. amadivayisi athambekele ekuwohlokeni.Ibanga lokushisa elingcono kakhulu lokukhiqizwa kwe-silicon wafer ngu-35 ~ 45%.
